26-01-3114 Spécifications Approfondies : Pas, Montage et Brochage Expliqués
A comprehensive technical guide for PCB designers and engineers.
The 26-01-3114 is widely listed in datasheet and distributor summaries as a dual-row, right-angle through-hole PCB header with a 4.2 mm (0.165 in) in‑row pitch and short tails. Small mismatches in pitch, mounting or pin mapping are a common root cause of board re-spins. This brief, data-led guide explains pitch, mount style and pinout in practical terms.
References below assume checking the official datasheet and distributor listings for exact tolerances; the discussion uses those public specs generically to illustrate footprint, mechanical clearance and BOM fields designers should verify before layout sign-off.
1 Background: Why Details Matter
1.1 Key identifier summary
Point: The part is a dual-row right-angle through-hole header commonly furnished in low pin-count variants. Evidence: distributor and datasheet summaries consistently list a 4.2 mm in‑row pitch, two offset rows, and short right-angle tails. Explanation: That form factor dictates board hole sizes, row spacing and keepouts; plating and material notes from listings guide solderability and current capacity decisions.
1.2 Why pitch, mount and pinout drive PCB success
Point: Incorrect pitch, mounting angle or pin mapping causes mechanical interference and poor solder joints. Evidence: common failure modes recorded in assembly logs include misaligned pads and insufficient tail engagement. Explanation: A 0.1 mm pad offset can prevent full tail insertion, and a short tail length reduces available fillet area, so strict footprint and pinout checks prevent rework and delays.
2 — Mechanical Specs Deep-Dive
2.1 Pitch explained (what 4.2 mm means for layout)
Point: Pitch equals center‑to‑center spacing between pins; for this dual-row header the in‑row pitch is 4.2 mm (0.165 in) and row‑to‑row spacing is an independent datum. Evidence: distributor/datasheet summaries define both dimensions separately. Explanation: Layout must use a grid matching the 4.2 mm in‑row spacing, with row offset accounted for; recommended land pattern tolerances include ±0.1 mm pad placement and annular rings sized for the intended drill.
2.2 Other critical mechanical dims
Point: Tail length, any plastic locator pegs and the right‑angle body profile determine board clearance and mechanical retention. Evidence: mechanical drawings in listings show short tails that require full through‑hole insertion and pegs that align to dedicated holes. Explanation: Account for tail protrusion in side profiles, reserve keepout under the right‑angle body, and verify peg hole locations to avoid obstruction of nearby components.
3 — Mounting & PCB Footprint
3.1 Footprint rules
Reliable through‑hole solder joints start with correct pad and drill specs. Use a drill that yields a snug tail fit (nominal +0.15–0.25 mm) and define pad diameters to allow consistent fillets.
3.2 Layout tips
Specify a keepout matching the connector body footprint, include through‑hole pegs for mechanical loads, and add clear silkscreen markers for pin‑1.
4 — Pinout & Electrical
4.1 Pin mapping
Follow a defined numbering sequence—document it visually. Provide a top view diagram and BOM notes indicating physical location of pin 1.
4.2 Electrical specs
Use rated current to set trace width and thermal derating. Confirm plating for solderability and corrosion resistance (e.g., tin or selective plating).
5 — Assembly, Soldering & Test
5.1 Soldering: For wave soldering, set conveyor speed and preheat to allow full fillet formation on right‑angle tails. Inspect fillets for wetting on both pad and tail.
5.2 Test Checklist: Pre‑assembly verify footprint dimensions; post‑assembly run continuity, solder fillet inspection and a mating test with the harness.
6 — Procurement & Troubleshooting
6.1 BOM Specifications: Specify full part number, 4.2 mm pitch, right‑angle through‑hole style, tail length, plating, and peg features to avoid substitution errors.
| Issue | Cause | Diagnosis | Fix |
|---|---|---|---|
| Misaligned mating housing | Wrong row spacing | Failed mating test | Update row‑to‑row offset in footprint |
| Insufficient solder fillet | Short tail / wrong hole size | Visual/AXI inspection | Increase hole tolerance, adjust wave profile |
| Poor mechanical retention | No pegs or reinforcement | Pull test fail | Add peg holes or mechanical rivets |
Summary
- Verify the 4.2 mm pitch and row spacing in your footprint to prevent mating and alignment errors.
- Design the footprint for right‑angle tails: correct drill, pad sizes and keepouts, and include reinforcement for mechanical loads.
- Document pinout unambiguously with a top‑down PCB pin diagram and include electrical limits in the BOM.
Frequently Asked Questions
How should designers verify the 26-01-3114 pitch and row spacing before layout?
Designers should cross‑reference the datasheet mechanical drawing, confirm the 4.2 mm in‑row pitch and the specified row‑to‑row offset, then implement those values in CAD with a ±0.1 mm placement tolerance.
What drill and pad sizes are recommended for right-angle through-hole tails?
Use a drill that gives a snug fit: nominal tail diameter plus ~0.15–0.25 mm; annular rings of at least 0.25 mm are recommended. Specify thermal reliefs if wave soldering.
Which BOM fields prevent incorrect substitutions for right-angle PCB headers?
Include the exact part number, pitch (4.2 mm), mounting angle (right‑angle through‑hole), tail length, plating/material and any peg/locator features.
