TH235-2-500G-JAR

TH235-2-500G-JAR

Part number
TH235-2-500G-JAR
Product Categories
Adhesives, Epoxies, Greases, Pastes
Manufacturer
Penchem Technologies Sdn Bhd
Describe
NON SILICONE THERMAL PUTTY
Encapsulation
-
Package
Bottle
ROHS status
Yes
Price
USD $83.9700
Data sheet
Quantity
RFQ
In stock: 56
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$83.9700
$83.9700
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Purchase and inquiry

Specification

Transport

Data sheet

ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.

TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH235-2
PackageBottle
Product StatusACTIVE
ColorBlue
Size / Dimension500 gram Container
TypeNon-Silicone Putty
Thermal Conductivity4.00W/m-K
Shelf Life18 Months
Usable Temperature Range5°F ~ 248°F (-15°C ~ 200°C)

Shipping fee


Shipping starts at $40, but can be over $40 for some countries. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
Basic shipping charges (package ≤0.5kg or corresponding volume) depend on time zone and country.


Mailing method


Currently, our products are shipped via DHL, FedEx, SF and UPS.


Delivery time


Once the goods are shipped, the estimated delivery time depends on the shipping method you choose:

FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

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