54819-0519 Mini USB B Receptacle Datasheet: Specs & Pinout
The 54819-0519 is a 5-contact Mini USB B receptacle engineered for USB 2.0 signaling (up to 480 Mbps), furnished in a right‑angle through‑hole mounting style with typical mating durability measured in thousands of cycles. You will use this datasheet‑driven guide to extract the electrical specs, pinout, mechanical footprint, assembly notes, and sourcing checks so your design and validation proceed without ambiguity. The term Mini USB B receptacle appears where you must verify mechanical and electrical limits against your product goals.
This article gives pragmatic, checklist‑style extraction steps and practical commentary so you can record contact resistance, insulation values, rated current, mating cycles, footprint drills, and test methods directly from the official datasheet. Wherever precise numeric limits are required, mark “specify per datasheet” and populate values from the vendor PDF before PCB release or procurement.
Overview: What the 54819-0519 Mini USB B Receptacle Is
Key features at a glance
Point: The connector is a right‑angle, five‑contact Mini B receptacle intended for USB 2.0 host/device and OTG use.
Evidence: Datasheet calls out five contacts with functions for VBUS, D‑, D+, ID and GND and notes gold or tin plating options.
Explanation: For early capture in your BOM and schematic, record contact count, plating option, rated current per VBUS, and mating durability so you can select plating and finish that meet expected life and contact resistance targets.
Performance Visualization (USB 2.0 Standard)
Compliance and common electrical/physical categories
Point: Verify RoHS/lead‑free, USB 2.0 signaling compliance, insulator flammability, and operating temperature.
Evidence: The datasheet lists environmental and regulatory categories you must record.
Explanation: These compliance items determine signal integrity (impedance control), manufacturing constraints (lead‑free assembly), and suitability for operating environments; document each item to avoid late rework or qualification gaps.
Datasheet Specifications: Electrical & Performance Details
Electrical characteristics
Capture contact resistance (max/typ), insulation resistance, dielectric withstand voltage, rated current, maximum data rate, and any ESD ratings. Typical datasheet tables present both typical and maximum values along with test conditions. Use maximum ratings for worst‑case safety margins.
Environmental & Reliability
Key reliability metrics include mating cycles, operating/storage temps, humidity or shock notes, and plating effects. Choose gold plating where low contact resistance and durability matter; tin is cost‑sensitive but may require stricter considerations.
Pinout & Mechanical Drawing: Read the 54819-0519 Pinout Correctly
Pin-by-pin functions and electrical notes
Map each pin to its electrical role and note placement of shield tabs. Standard Mini‑B mapping is Pin 1=VBUS, Pin 2=D‑, Pin 3=D+, Pin 4=ID, Pin 5=GND, plus shell/shield ties.
| Pin Number | Function Name | Description |
|---|---|---|
| 1 | VBUS | Power (+5V typically) |
| 2 | D- | USB Data- differential pair |
| 3 | D+ | USB Data+ differential pair |
| 4 | ID | OTG Identification (Host/Device) |
| 5 | GND | Signal ground connection |
Mechanical drawing and recommended PCB footprint
Extract overall envelope, hole sizes/positions, solder fillet recommendations and keepout areas. Before releasing the footprint, create a checklist: drill sizes, pad copper, soldermask expansion, keepout for mating clearance, and board‑edge clearance if you mount near the PCB edge; verify with a mechanical sample.
Mounting, Assembly & Testing Guidelines
Soldering Best Practices
Use the recommended soldering method and preheat to avoid thermal shock to the insulator. For right‑angle THT connectors, prefer controlled wave or selective soldering with proper fixturing; specify flux cleaning and post‑solder mechanical inspection.
Inspection & Testing
Implement a focused inspection: solder joint quality, shield continuity, pin continuity/isolation. Your production test should include continuity vector checks, optional Hi‑Pot per spec, and differential eye checks for sample lots.
Applications, Alternatives & Sourcing Considerations
Deploy this Mini B receptacle in mobile, legacy peripheral, OTG or compact embedded designs. Its USB 2.0 signaling and OTG ID pin support make it suitable for host/device roles in constrained enclosures.
Sourcing Checklist: Confirm orientation, mounting style, plating, shell tab presence and RoHS status. Validate footprint match with mechanical drawing, request samples for fit/mating tests, and ensure lot traceability.
Summary
Use the 54819-0519 datasheet to capture pinout (VBUS, D‑, D+, ID, GND), mechanical footprint, and electrical/environmental ratings before layout and procurement; validate plating, mating cycles, and compliance items on the official datasheet. For critical numeric values, mark “specify per datasheet” and populate them from the official PDF to avoid errors in production and qualification.
- • Record core electrical values: contact resistance, insulation resistance, dielectric withstand voltage, and rated VBUS current before finalizing the schematic and power protection strategy.
- • Verify mechanical dimensions: drill diameters, shell tab locations, solder fillet specs, and keepout for mating clearance in the PCB footprint checklist.
- • Plan assembly and testing: select soldering method, include shield continuity and differential eye checks, and run mating cycle samples to confirm durability for your use case.
