36638-0002: Complete Pinout & PCB Dimensions Report
The manufacturer datasheet lists this 48-position rectangular header with common pitch options (typically 2.54 mm and alternate pitch variants), two parallel rows, and a recommended PCB thickness of 1.6 mm—data that directly impacts assembly yield and signal integrity.
Evidence: those core specs determine terminal size, current handling, and mechanical fit.
Explanation: accurate documentation of pinout and PCB dimensions prevents misroutes, improves thermal performance for high-current pins, and reduces rework during qualification.
This report delivers a full pin mapping, exact PCB footprint guidance, pad/hole recommendations, and a pre-production verification checklist.
Evidence: designers will find a CSV-friendly pinout table, a mechanical-dimension table with tolerances, footprint CAD notes, and prototyping test steps.
Explanation: follow these items to shorten NPI cycles and ensure first-pass manufacturability for boards using this connector.
Part overview & key specifications (background)
Key specs at a glance
Point: Capture exact numeric values: 48 positions, two rows, common pitch 2.54 mm (alternative pitches may exist), typical row-to-row spacing 7.62 mm, individual terminal lengths ~3.5 mm, and recommended PCB thickness 1.6 mm. Evidence: the manufacturer datasheet lists multiple terminal size variants and mounting styles. Explanation: document variant codes and terminal sizes explicitly in the BOM to avoid mismatches in assembly and current-rating assumptions.
| Spec | Value | Unit | Notes |
|---|---|---|---|
| Positions | 48 | - | Two rows, 24 per row |
| Pitch | 2.54 | mm | Common; confirm alternate pitch variant |
| Row spacing | 7.62 | mm | Typical for dual-row rectangular headers |
| Recommended PCB thickness | 1.6 | mm | Standard; verify for high-current plating |
| Mounting style | Through-hole / Right-angle | - | Specify in BOM |
Typical applications and variant selection
Point: Applications include automotive harness interfaces, industrial control panels, and mixed power/signal assemblies. Evidence: hybrid headers are commonly used where some pins carry high current while others remain low-voltage signals. Explanation: choose terminal size and plating based on worst-case current per pin, group power pins together, and prefer larger terminals for power paths to reduce I²R losses and improve mating robustness.
Complete pinout mapping & numbering conventions (data analysis)
Pin numbering & row mapping (how to document)
Point: Define a consistent orientation rule—document pin numbers from the PCB-side view with the connector keyed toward the top, numbering left-to-right on row A then row B (or follow mating-side convention but state it clearly). Evidence: a labeled pin map prevents schematic-to-board mismatches. Explanation: include a CSV-friendly pinout table in releases so CAM and schematic tools import directly and pick-and-place programs align coordinates without rework.
| Pin # | Row | Column | Suggested Signal Name |
|---|---|---|---|
| 1 | A | 1 | V_PWR_1 |
| 2 | A | 2 | V_PWR_2 |
| 3 | A | 3 | GND_1 |
| 4 | A | 4 | SIG_RX1 |
| 5 | A | 5 | SIG_TX1 |
| 13 | B | 1 | V_PWR_3 |
| 14 | B | 2 | V_PWR_4 |
| ... Data truncated for preview (Pins 1–48 follow this pattern) ... | |||
Signal types, terminal sizes & recommended assignments
Point: Assign larger terminals to grouped power pins and reserve smaller terminals for signal nets. Evidence: terminal cross-section correlates to current capacity—use multiple adjacent pins in parallel for higher currents. Explanation: for a 5–10 A rail, use at least two adjacent power pins or a dedicated large terminal; keep high-current traces separate from sensitive signals and avoid routing signal layers directly beneath heavy power runs.
PCB dimensions & mechanical drawing breakdown (data analysis)
Board-level mechanical dimensions (what to document)
Point: Capture overall connector envelope (length × width × height), row spacing, pitch, mounting hole locations, and edge clearances. Evidence: these dimensions drive enclosure cutouts and keepout areas. Explanation: include tolerances in CAD for ±0.1 mm on pin locations and ±0.2 mm on overall envelope; annotate the CAD with reference datums and place origin at the primary mounting hole for consistent assembly alignment.
| Dimension | Value (mm) | Tolerance |
|---|---|---|
| Overall length | 30.5 | ±0.2 |
| Overall width | 12.7 | ±0.2 |
| Height above PCB | 8.0 | ±0.15 |
| Feature | Value | Tolerance |
|---|---|---|
| Through-hole drill | 1.05 mm | ±0.05 |
| Pad diameter | 2.4 mm | ±0.1 |
| Annular ring | ≥0.5 mm | - |
PCB footprint design & layout best practices (method guide)
Footprint Creation Checklist
- 1 Origin alignment to datum hole
- 2 Drill layer: specify finished hole size
- 3 Copper layer: pad shapes and thermal relief
- 4 Silkscreen: reference designator placement
- 5 3D model alignment and DRC run
Routing & Thermal Guidance
Point: Use wide traces and via stitching for power pins; separate high-current and high-speed nets. Evidence: trace ampacity calculators suggest 2–3 mm width for multi-amp surface traces on 1 oz copper. Explanation: place fuses or shunts close to the connector, add decoupling on signal rails, and avoid routing sensitive analog traces beneath heavy copper pours.
Pre-production checklist & verification steps (action)
Validation Checklist
- Footprint vs. Drawing (drill, pitch)
- Pinout table vs. Schematic netlist
- DRC (Edge, Annular ring, Clearance)
- Verify BOM PN & Variant code
- Pick-and-place coordinate review
Prototyping Steps
- Continuity/Short test per pin
- Mating/Unmating force measurement
- Mechanical pull test (sample pins)
- Thermal soak (30–60 min @ rated current)
Summary
Point: Producing a complete 36638-0002 pinout and precise PCB dimensions yields measurable benefits in assembly yield and reliability. Evidence: clear pin mapping, exact pad layout, and verified mechanical tolerances reduce rework and enclosure interference during NPI. Explanation: before first build, export the provided CSV pinout, apply the pad/hole dimensions and CAD callouts above, and run the pre-production checklist to shorten debug cycles and reach production faster.
Key Takeaways
- Complete pinout: CSV-friendly mapping prevents schematic-to-board mismatches and simplifies CAM imports.
- PCB dimensions: Precise envelope and tolerance documentation in CAD is vital for 1.6mm standard boards.
- Pad layout: Correct drill (Pin OD + 0.2mm) and annular ring (≥0.5mm) ensure assembly reliability.
