43045-0602 6-pin 3.0mm header: Complete spec & data
43045-0602 6-Pin 3.0mm Header: Complete Specifications & Data Analysis
Industry surveys show a large share of wire-to-board designs migrate to 3.0 mm pitch when higher mechanical robustness and current capacity are required versus 2.54 mm alternatives; roughly one-in-three small-form connectors in industrial and appliance designs use 3.0 mm variants. This technical guide delivers a concise, actionable specification, verification, and sourcing guide for the 43045-0602 6-pin 3.0mm header.
Product Overview & Typical Applications
What the 43045-0602 is
The 43045-0602 is a single-row, through-hole wire-to-board header in a fixed 6-pin configuration with a 3.0 mm pitch. It serves as a compact, robust interface for mating housings or crimp housings, optimized for scenarios where higher-current or superior mechanical retention is required compared to standard 2.54 mm headers.
Common Application Scenarios
- Industrial Control: Power and sensor harnesses where vibration resistance and 1–3 A per pin are required.
- Consumer Appliances: Modular assemblies requiring reliable mating and predictable pinouts.
- Test Fixtures: Robust insertion/extraction cycles with clear pin labeling.
Complete Technical Specification
Mechanical Dimensions & Footprint
The key pitch is 3.00 mm; a 6-pin row yields a nominal overall row length near 15.00 mm (center-to-center). Recommended PCB footprint uses 1.0–1.2 mm diameter plated through-holes.
| Parameter | Typical Value |
|---|---|
| Pitch | 3.00 mm |
| Row length (center to center) | ~15.00 mm (6 pins) |
| Recommended drill | 1.0–1.2 mm |
| Annular pad | 1.8–2.2 mm dia. |
| Hole tolerance | ±0.1 mm |
Electrical & Material Performance
PCB Footprint, Mounting & Assembly Guidance
PCB Design Strategy
Use through-hole pad pairs sized per the drill table. Place supporting mechanical vias every 10–12 mm adjacent to the header to reduce flex. Define a 0.5–1.0 mm keepout area in the PCB CAD to avoid SMD components directly behind tail exits.
Soldering & Reflow
Typical lead-free reflow peak 235–245°C. For hand soldering, use a 350–370°C iron. Avoid prolonged heating to prevent insulator deformation. Ensure full wetting around the tail with a 0.2–0.6 mm fillet height.
Verification, Testing & Failure Modes
- ✔ Continuity: Measure all pins; expect <40 mΩ per contact.
- ✔ Mechanical: Verify mating cycles (100–1000 depending on plating).
- ✘ Fatigue: Mitigate solder-joint fatigue with strain relief cable ties.
- ✘ Wear: Use gold plating for high-cycle reliable mating requirements.
Summary
- The 43045-0602 delivers a durable 3.0 mm pitch interface suitable for wire-to-board and low-voltage power applications.
- Key parameters: 3.00 mm pitch, 1.0–1.2 mm drill size, 1–3 A per pin rating.
- Always validate solder fillet quality and include keepout zones to reduce joint fatigue and misalignment risk before committing to mass production.
