503480-0400 connector: Complete Specs & Quick Data
The 503480-0400 connector is a 0.50 mm pitch, 4-position right-angle SMT FFC/FPC interface used where very compact, low-profile flex connections are needed. This one-page, engineer-ready brief summarizes the specs and PCB/assembly guidance needed for first-pass selection and layout.
Background & Typical Applications
Connector Profile
Point: Low-profile, right-angle surface-mount FFC/FPC connector in a 4-circuit format.
Evidence: 0.50 mm pitch, one-row, right-angle SMT housing with dual-contact terminals.
Explanation: Targets compact devices where a flex tail must turn 90° to lie along the PCB while preserving a small Z-height.
Strategic Selection
Point: Ideal for space-constrained flex interfaces.
Evidence: Used in mobile displays, wearables, and camera modules.
Explanation: Dual-contact terminals increase reliability for thin flex conductors while right-angle SMT simplifies routing parallel to the board.
Datasheet Snapshot: Key Specs at a Glance
Electrical & Mechanical Performance
| Attribute | Typical Value / Notes |
|---|---|
| Pitch | 0.50 mm |
| Positions | 4 circuits |
| Current (typical) | ˜0.5 A per contact (verify in datasheet) |
| Contact Construction | Dual-contact termination, gold over nickel plating |
| Mounting | Right-angle SMT with mechanical anchors |
Pinout, Dimensions & PCB Footprint
Pin Numbering & Layout
Correct pin orientation prevents wiring mistakes. Pin 1 is typically the end closest to the keyed side. The dual-contact design engages the flex on both sides of the conductor to maximize connectivity.
Land Pattern Strategy
Recommended land patterns use rectangular SMT pads with anchor pads for mechanical retention. Ensure solder-mask openings are sized to datasheet recommendations to maintain signal integrity.
Soldering, Assembly & Validation Guide
SMT Reflow Precautions
- •Follow manufacturer-specified reflow profiles.
- •Minimize mechanical stress during pick-and-place.
- •Control placement force to avoid housing deformation.
Inspection Checklist
- •Visual inspection of solder fillets.
- •Continuity and insulation resistance tests.
- •Retention and pull-force verification.
- 01 Compact Footprint: 0.50 mm pitch and 4 circuits enable tight board layouts; verify current rating for power paths.
- 02 Durability: Gold-plated dual contacts balance reflow survivability and reliable contact life; check UL ratings.
- 03 Validation: Confirm pad geometry and reflow profile before prototype; include retention tests in first-article validation.
