502352-0700 Wire-to-Board Header: Complete Specs & Data

12 February 2026 24

The 502352-0700 wire-to-board header is a 7-position, single-row, right-angle surface-mount connector with a 2.00 mm pitch, tin (Sn) plated contacts and a polyamide (PA) housing. This technical guide breaks down critical specifications and provides actionable QA steps for professional production environments.

Background & Quick Overview

502352-0700 Wire-to-Board Header Technical View

Snapshot Specification Table

Attribute Value Test / Tolerance
Positions 7
Pitch 2.00 mm (0.079") ±0.10 mm typical
Orientation Right-angle SMT footprint critical
Mounting Style SMD / SMT Reflow compatible
Plating Tin (Sn) Thickness per datasheet
Insulation Resistance
~1 GΩ
Confirmed via test voltage

Part-numbering & Family Context

Part numbers in this family encode position count, plating, and orientation; the 0700 suffix identifies the seven-position header. Closely related variants span 3–7 positions and include vertical and right-angle orientations. For alternatives, prioritize matching pitch (2.00 mm) and row count before comparing plating and housing materials.

Deep Dive: Electrical & Mechanical Specs

Electrical Specifications

Confirm contact resistance, insulation resistance, and rated current per circuit. Typical acceptance criteria involve:

  • Milliohm-level contact resistance after mating cycles.
  • Dielectric tests at specified AC or DC voltages.
  • Current derating assessment at elevated ambient temperatures.

Mechanical & Dimensional

Critical data for PCB design includes:

  • Recommended land pattern and solder mask keep-out zones.
  • Pin center tolerances to prevent tombstoning.
  • Mating durability and maximum lead-free reflow temperature limits.

Variants, Packaging & Ordering Info

Common Variants

Variants alter plating (gold vs. tin) and orientation. Gold improves low-voltage reliability, while tin is cost-effective for general purpose. Vertical vs. right-angle choices change the PCB footprint and mechanical loading profiles.

Packaging Details

Supplied in tape-and-reel for automated SMT pick-and-place or trays for manual assembly. For high-volume lines, confirm leader/trailer specs and pick positions to ensure seamless production integration.

Typical Applications & Design Considerations

&udens;
Consumer Electronics Board-to-harness interfaces & small modules.
Industrial Modules Compact control assemblies and sensor nodes.
Sensor Interfaces Low-profile SMT benefits small-pitch designs.

Note: Evaluate conformal coating and cleaning compatibility with polyamide (PA) housings and tin contacts during the design phase.

Selection, Testing & PCB Assembly Checklist

Pre-purchase Selection

  • Mating connector compatibility check
  • Pitch and PCB footprint verification
  • Rated current vs. application demand
  • Lifecycle and supplier availability
  • Exact numeric specs from official datasheet

Assembly Validation & QA

  • Stencil design and aperture verification
  • Reflow profile validation (Lead-free)
  • Visual/X-ray solder joint inspection
  • Pull-out force & terminal retention tests
  • First-article electrical continuity checks

Summary

  • The 502352-0700 is a 7-position, 2.00 mm pitch right-angle SMT header. Verify contact resistance and rated current in the official datasheet before purchase.
  • Choose variants (plating, orientation) based on signal integrity requirements and assembly constraints (Tape & Reel vs. Tray).
  • Implement targeted QA: validate reflow profiles and perform pull-out tests to ensure long-term reliability in production.

Frequently Asked Questions

Q: What electrical specs should I verify for the 502352-0700 wire-to-board header?
Verify contact resistance, insulation resistance, rated current per circuit, dielectric withstanding voltage, and recommended wire gauge. Confirm exact test conditions (voltage/temperature) listed in the official manufacturer datasheet.
Q: How should PCB footprint and stencil be designed for this header?
Follow the datasheet's recommended land pattern and pad dimensions. Include solder mask keep-out zones and use the suggested stencil aperture percentage to achieve correct solder volume, avoiding bridging or insufficient fillets.
Q: What assembly tests are essential when onboarding this header?
Essential tests include reflow profile validation, visual/X-ray inspection of SMT joints, electrical continuity checks, and terminal retention testing. Always perform a documented first-article inspection.