87568-1073 Connector: Technical Data & Key Specs Overview
The 87568‑1073 connector is a high‑performance 10‑position, 2‑row IDC/Milli‑Grid receptacle featuring a 2.00 mm pitch. Engineered for reliability, it supports 1 A per contact and a 125 V maximum rating, utilizing gold‑plated beryllium copper contacts housed in a UL 94 V‑0 polyester casing.
Background & Product Overview
Device Classification & Variants
Core Design: This component is a high‑density IDC receptacle within the Milli‑Grid family. Its 10‑position, 2×5 layout with 2.00 mm spacing ensures compatibility with modern compact electronics.
Common Variants: Available in board‑mount and cable‑receptacle configurations, with options for right‑angle or vertical orientations. Packaging typically follows industry standards such as embossed tape or bulk for automated assembly.
Typical Use Cases & Target Applications
Designed for low‑power signal transmission and compact wire harnesses, the 87568‑1073 is the preferred choice for:
Key Specifications at a Glance
| Parameter | Typical Value | Technical Note |
|---|---|---|
| Positions / Rows | 10 / 2 | 2×5 matrix configuration |
| Insulation Resistance | >10&sup6; Ω | High dielectric integrity |
| Contact Resistance | <10 mΩ | Targeting single‑digit milliohms |
| Housing Material | Polyester (UL 94 V‑0) | Flame retardant polymer |
Materials, Finishes & Environmental Ratings
Contact Metallurgy
The base metal is high‑grade beryllium copper, selected for its superior spring properties and conductivity. Critical interface areas feature gold plating, which ensures low contact resistance and long‑term reliability against corrosion. Designers should specify plating thickness based on anticipated mating cycles.
Thermal Performance
Engineered for industrial environments, the polyester housing maintains mechanical stability across a wide temperature range. It is crucial to verify process temperatures for solder reflow to ensure the housing remains within its thermal deformation limits during assembly.
Dimensional Drawing & Mechanical Integration
Pinout & Grid Pattern
The 87568‑1073 adheres to a precise 2.00 mm × 2.00 mm grid. For PCB integration, always cross‑reference the official mechanical drawing for:
- Exact pin centers and reference datums.
- PCB pad sizes and drill tolerances.
- Soldermask keepouts and mechanical clearance.
Mounting & Strain Relief
Mechanical robustness is heavily dependent on mounting style. For cable assemblies, integrated strain relief or secondary adhesive supports are recommended to prevent contact stress during vibration or maintenance. Plan cable routing paths to minimize flex near the termination point.
Performance & Reliability
Environmental Testing
Standard qualification tests include humidity exposure, salt spray, and vibration resistance. Lot‑traceable data ensures the connector meets its rated thresholds in harsh conditions.
Lifecycle Rating
Expected mating cycles are typically in the range of tens to hundreds, depending on the gold plating thickness. Periodic inspections are recommended for mission‑critical applications.
- Verify Compatibility: Confirm pitch, position count, and gender against the CAD model.
- Specify Plating: Align gold thickness with the intended lifecycle to optimize cost and reliability.
- Assembly SOPs: Use calibrated IDC tooling and perform post‑assembly continuity checks.
- Traceability: Request supplier test reports covering humidity, vibration, and contact resistance.
