51004-0700 Datasheet: 7-pos 2.0mm Housing Quick Specs
Professional interconnect solutions for dense signal and light-power applications.
The 51004-0700 is a compact, 7-position, 2.0mm pitch wire-to-board/wire-to-wire housing intended for dense signal and light-power interconnects. This quick-specs guide extracts the essential electrical, mechanical, and assembly data so engineers can verify fit, footprint, and procurement notes in one read. The introduction highlights where to check the official datasheet entries for ratings, materials, and dimensional tolerances before CAD or BOM decisions.
At-a-Glance Specification Summary
| Parameter | Value / Specification |
|---|---|
| Pitch |
2.0 mm
|
| Positions | 7 Positions |
| Primary Use | Compact signal/light-power harnesses |
| Contact Finish | Tin or Gold variants (Refer to datasheet) |
| Housing Material | Thermoplastic (Refer to flammability class) |
| Mating Cycles | Verified per datasheet lifecycle targets |
Product Snapshot: 51004-0700 Background
Key Identifiers & Typical Use Cases
Point: The 51004-0700 is identified by its 7 positions and 2.0mm pitch and is commonly referenced on BOMs by its full part number. Evidence: The datasheet entry names pitch and position explicitly for clear procurement. Explanation: On a BOM line list, the full part number, pitch, pos count, and intended function (signal or low-power) should be listed so purchasers and assemblers can match mating housings and verify packing format.
Design Integration
Point: Designers choose a 2.0mm housing when board density is a priority but moderate current is acceptable. Evidence: The datasheet separates signal-class ratings from power-class ratings, guiding selection. Explanation: Trade-offs are density versus current carrying ability and robustness—use 2.0mm pitch for compact harnesses and signal headers, and reserve larger pitches for higher current or harsher mechanical environments.
Quick Specs: Datasheet Technical Summary
Electrical & Environmental Highlights
The datasheet consolidates rated current, voltage, contact resistance, insulation resistance, and dielectric withstanding voltage under electrical highlights. These fields appear in the technical table that differentiates signal versus power suitability. For signal wiring, prioritize low contact resistance and insulation resistance; for any power use, check rated current and dielectric voltage margins against your worst-case operating and transient conditions.
Mechanical & Material Highlights
Mechanical and material notes identify housing thermoplastic grade, contact plating options, retention features, and mating cycles. Datasheet material and plating lines define flammability and finishing that affect soldering and longevity. Confirm plating (tin vs gold), latch style, and specified mating cycles—these influence reliability, corrosion resistance, and whether the part meets UL/V-0 or equivalent flammability classifications for your assembly.
Pinout, Contact Layout & Wiring
Pin Numbering & Orientation
Pin numbering and orientation should mirror the drawing in the datasheet and be shown in both schematic and PCB silkscreen. Typical datasheet drawings show a top view with pin 1 marked and sequential numbering across the row. Present a small wiring table mapping pin numbers to functions (e.g., Pin 1 GND, Pin 4 VCC, Pin 7 SIG) so harness builders and firmware teams share an unambiguous reference.
Mating & Polarization
Physical keys, chamfers, or asymmetrical latches provide polarization and prevent reverse mating. Dimensional drawings describe the recommended mating direction. Mark the PCB silkscreen with the mating direction and pin-1 indicator; call out polarization cues on drawings so automated pick-and-place and manual insertion follow the same orientation rules.
Mechanical Dimensions & 3D Assets
Critical Dimensions: Extract pitch, overall length/width/height, lead spacing, wall thickness, and latch protrusion as critical dimensions for CAD. The datasheet dimension table lists those values plus recommended tolerances.
CAD/3D Guidance: STEP or IGES models should mirror the datasheet outline and include mounting clearances for mating. When creating or importing models, name files with part number and revision, keep mating clearance of at least one pitch height, and place mechanical features on separate layers for easier export to MCAD and ECAD systems.
PCB Footprint & Assembly Practices
- • Footprint Specs: The footprint must match plated-through or SMD pin geometry and allow inspection and rework access. For through-hole variants, use the provided drill sizes and annular ring guidance; for SMD, keep-out areas and solder fillet zones per datasheet.
- • Soldering Tips: If the housing is reflow-compatible, follow the suggested temperature profile; otherwise, hand-insert and wave-solder or use fixtures to secure housings during soldering to avoid movement or thermal stress.
Ordering & Compliance
Decoding Part Numbers: Suffixes often indicate color, plating finish, keyed vs. non-keyed options, and packing format. When ordering, verify color, plating (tin/gold), and packaging (tape & reel vs. bag) to match assembly yields and MOQ expectations.
Compliance Checklist: Before placing the part on a BOM, run a checklist: electrical ratings, mechanical fit, footprint verification, material flammability (UL/V-0), and required certifications. Request test reports from the supplier if dielectric or mating cycle data is omitted.
Summary
The 51004-0700 compact 7-position, 2.0mm housing targets dense signal and light-power interconnects. Prioritize verifying electrical ratings, footprint dimensions, and mechanical tolerances against your board and assembly constraints before committing to a BOM. Refer to official datasheet entries for final rated values to ensure fit, reliability, and compliance.
