26-01-3114 مواصفات تفصيلية: التباعد والتركيب وتهيئة الاتصالات موضحة
The 26-01-3114 is widely listed in datasheet and distributor summaries as a dual-row, right-angle through-hole PCB header with a 4.2 mm (0.165 in) in‑row pitch and short tails; small mismatches in pitch, mounting or pin mapping are a common root cause of board re-spins and assembly delays. This brief, data-led guide explains pitch, mount style and pinout in practical terms so designers can pick, footprint and assemble the part without surprises.
References below assume checking the official datasheet and distributor listings for exact tolerances; the discussion uses those public specs generically to illustrate footprint, mechanical clearance and BOM fields designers should verify before layout sign-off.
1 — Background: What the 26-01-3114 is and why details matter
Point: The part is a dual-row right-angle through-hole header commonly furnished in low pin-count variants. Evidence: distributor and datasheet summaries consistently list a 4.2 mm in‑row pitch, two offset rows, and short right-angle tails. Explanation: That form factor dictates board hole sizes, row spacing and keepouts; plating and material notes from listings guide solderability and current capacity decisions.
1.2 Why pitch, mount and pinout drive PCB success
Point: Incorrect pitch, mounting angle or pin mapping causes mechanical interference and poor solder joints. Evidence: common failure modes recorded in assembly logs include misaligned pads and insufficient tail engagement. Explanation: A 0.1 mm pad offset can prevent full tail insertion, and a short tail length reduces available fillet area, so strict footprint and pinout checks prevent rework and delays.
2 — Mechanical specs deep-dive: Pitch, row spacing, and physical dimensions
2.1 Pitch explained (what 4.2 mm means for layout)
Point: Pitch equals center‑to‑center spacing between pins; for this dual-row header the in‑row pitch is 4.2 mm (0.165 in) and row‑to‑row spacing is an independent datum. Evidence: distributor/datasheet summaries define both dimensions separately. Explanation: Layout must use a grid matching the 4.2 mm in‑row spacing, with row offset accounted for; recommended land pattern tolerances include ±0.1 mm pad placement and annular rings sized for the intended drill.
3 — Mounting & PCB footprint guide
3.1 Footprint rules: pads, thermal reliefs and drill sizes
Point: Reliable through‑hole solder joints start with correct pad and drill specs. Evidence: common footprint recommendations call for drilled holes sized to the nominal tail diameter plus plating and tolerance, with annular rings of at least 0.25 mm. Explanation: Use a drill that yields a snug tail fit (nominal +0.15–0.25 mm), define pad diameters to allow consistent fillets, and add thermal reliefs when wave soldering.
| Issue | Cause | Diagnosis | Fix |
|---|---|---|---|
| Misaligned mating housing | Wrong row spacing | Failed mating test | Update row‑to‑row offset in footprint |
| Insufficient solder fillet | Short tail / wrong hole size | Visual/AXI inspection | Increase hole tolerance, adjust wave profile |
| Poor mechanical retention | No pegs or reinforcement | Pull test fail | Add peg holes or adhesive |
4 — Pinout & electrical considerations
Point: Dual‑row right‑angle headers follow a defined numbering sequence. Evidence: best practice schematics pair a top‑down PCB view with numbered pins. Explanation: Provide a top view diagram on the mechanical drawing and BOM notes indicating which physical location is pin 1. Use rated current to set trace width and thermal derating.
5 — Assembly, soldering & test
Point: Solder process choice affects fillet quality and mechanical strength. Evidence: assembly records show consistent fillets with controlled wave parameters. Explanation: For wave soldering, set conveyor speed and preheat to allow full fillet formation on right‑angle tails; for manual soldering, aim for consistent wetting and avoid excessive solder that can bridge rows.
Summary
- Verify the 4.2 mm pitch and row spacing in your footprint to prevent mating and alignment errors.
- Design the footprint for right‑angle tails: correct drill, pad sizes and keepouts.
- Document pinout unambiguously with a top‑down PCB pin diagram and include electrical limits.
FAQ
How should designers verify the 26-01-3114 pitch and row spacing before layout?
Designers should cross‑reference the datasheet mechanical drawing and distributor dimensional summaries, confirm the 4.2 mm in‑row pitch and the specified row‑to‑row offset, then implement those values in CAD with a ±0.1 mm placement tolerance and run DRC against mechanical keepouts before releasing gerbers.
What drill and pad sizes are recommended for right-angle through-hole tails?
Use a drill that gives a snug fit: nominal tail diameter plus ~0.15–0.25 mm for plating and tolerance; annular rings of at least 0.25 mm are recommended. Specify thermal reliefs if wave soldering and confirm fillet geometry during process validation.
Which BOM fields prevent incorrect substitutions for right-angle PCB headers?
Include the exact part number, pitch (4.2 mm), mounting angle (right‑angle through‑hole), tail length, plating/material and any peg/locator features. Adding a mechanical drawing reference and required electrical ratings reduces the risk of receiving a look‑alike with incompatible dimensions.
What is the significance of the 4.2 mm pitch for PCB routing?
The 4.2 mm (0.165 in) pitch defines the primary routing grid; it requires specific land pattern offsets to accommodate dual-row spacing while maintaining clearance for high-current traces and preventing signal interference in dense layouts.
