BGA0030-S
Part Number:
BGA0030-S
Product Classification:
Solder Stencils, Templates
Manufacturer:
Chip Quik Inc.
Description:
BGA-36 (0.5 MM PITCH, 6 X 6 GRID
Packaging:
Bulk
ROHS Status:
Yes
Currency:
USD
PDF:
Documents
Specification
- Part Status Active
- Number of Positions 36
- Material Stainless Steel
- Pitch 0.020" (0.50mm)
- Thickness 0.0040" (0.102mm)
- Type BGA
- Inner Dimension -
- Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
- Thermal Center Pad -